বুধবার, ৪ মে, ২০১১

Leading-Edge 3D Transistors Going Into Ivy Bridge Chips

Intel on Wednesday announced a transistor breakthrough called 3D Tri-Gate. The chipmaker is ready to begin high-volume manufacturing of transistors using a three-dimensional structure.

The new chips could come to market as early as late this year. Intel first announced plans in 2002, but will soon use the design in 22-nanometer chips code-named Ivy Bridge.

Tri-Gate transistors are a fundamental change from the two-dimensional planar transistor structure that for decades has powered computers, mobile phones, and all other electronics, as well as electronic controls in cars, spacecraft, household appliances, medical devices, and many other devices.

"Intel's scientists and engineers have once again reinvented the transistor, this time utilizing the third dimension," said Intel President and CEO Paul Otellini. "Amazing, world-shaping devices will be created from this capability as we advance Moore's law into new realms."

Following Moore's Law

If Otellini sounds bullish on the latest innovation, that's because he is. Moore's law states that roughly every two years transistor density will double while increasing functionality and performance and decreasing costs. It has been the basic business model for the semiconductor industry for more than 40 years.

Scientists confirm the benefits of a 3D structure for sustaining Moore's law even at the nanometer level, where physical laws have threatened to stymie advances. Intel's ability to deploy the Tri-Gate design into high-volume manufacturing sets the stage for the next era of Moore's law and paves the way for a new generation of device innovations.

"The performance gains and power savings of Intel's unique 3D Tri-Gate transistors are like nothing we've seen before," said Mark Bohr, an Intel senior fellow. "This milestone is going farther than simply keeping up with Moore's law. The low-voltage and low-power benefits far exceed what we typically see from one process generation to the next. It will give product designers the flexibility to make...

Source: http://www.mobile-tech-today.com/story.xhtml?story_id=78415

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